From BigGo Finance · BigGo Finance · · 1m 40s
Intel Secures Foundry Deals With Tech Giants
Intel reportedly lands foundry contracts with Apple, Nvidia, Broadcom, and others.
In brief
Intel reportedly lands foundry contracts with Apple, Nvidia, Broadcom, and others. Intel has reportedly secured foundry contracts with Apple, Nvidia, Broadcom, AMD, Microsoft, and Google for advanced chips and packaging technologies. Originally reported by BigGo Finance.
Intel Wins Foundry Contracts

Intel reportedly secured foundry contracts from Apple, Nvidia, Broadcom, AMD, Microsoft, and Google.
Apple's Multi-Generation Chip Contract
Apple's A-series and M-series chip contract alone could represent 600,000 wafers and $15 billion to $20 billion in revenue.
Google's TPU Program Opportunity
Google's TPU programs could generate $12 billion to $15 billion through Intel's EMIB-T technology.
Other Tech Giants in Evaluation

Amazon AWS, Anthropic, and SpaceX's Terafab remain in evaluation for Intel's 18A-P and 14A processes.
Yield Challenges at Suppliers
Yield challenges at Ibiden and Unimicron could constrain near-term ramp-up for Intel's packaging.
Advanced Packaging Focus
Intel's EMIB-T technology embeds silicon bridges with through-silicon vias into organic substrates for 3D stacking.
Qualcomm and Amazon Programs
Qualcomm's AI300 ASIC and Amazon's Trainium 3 could use Intel's EMIB-M technology.
MediaTek's Potential Use
MediaTek could use Intel's EMIB-T for 2 million substrates in 2028 to support next-generation TPU v9 AI chips.
TSMC's Market Dominance
TSMC dominates leading-edge chips with 534 customers in 2025, top 10 accounting for 78% of net revenue.
Intel's Strategic Position
Intel is uniquely positioned as the only U.S.-based advanced logic manufacturer for second-source capacity.
Investor Concerns
Intel's stock has been under pressure as investors question its ability to compete with TSMC on technology and execution.
What to remember
Intel has reportedly secured foundry contracts with Apple, Nvidia, Broadcom, AMD, Microsoft, and Google for advanced chips and packaging technologies.



