From BigGo Finance · BigGo Finance · · 1m 10s
NVIDIA's Unified Spec Forces Samsung to Use TSMC 3nm
Samsung adopts TSMC's 3nm for NVIDIA's HBM base die, ending its one-stop memory production model.
In brief
Samsung adopts TSMC's 3nm for NVIDIA's HBM base die, ending its one-stop memory production model. Samsung Electronics began producing NVIDIA's NVHBM base dies using TSMC's 3nm process for the first time, breaking its one-stop memory production model. Originally reported by BigGo Finance.
NVIDIA's Unified Spec
NVIDIA requires Samsung, SK Hynix and Micron to use TSMC's 3nm process for NVHBM base dies.
“nvidia has made a uniform demand of its three nvhbm suppliers, samsung sk hynix and micron: the base die must use tsmc's 3nm process”
Samsung's Compliance
Samsung Electronics decided to comply after internal review, marking first use of TSMC's 3nm for HBM chip manufacturing.
“after internal review south korea's samsung electronics decided to comply marking the first time it has brought tsmc's process into the hbm chip manufacturing stage”
Base Die Shift
Samsung's standard HBM4 and HBM4E remain in-house while NVHBM base dies use TSMC 3nm.
“samsung's standard hbm4 and hbm4e will remain integrated in-house manufacturing with the base die using samsung's 4nm process”
Samsung's Backup Plan
Samsung validates producing NVHBM base dies on its own foundry lines as backup for TSMC capacity shortages.
“samsung is simultaneously validating whether it can manufacture nvhbm base dies on its own foundry lines as a backup for when tsmc capacity is insufficient”
Historical Context
Samsung and TSMC previously cooperated on packaging compatibility but not chip manufacturing.
“four years ago the two cooperated in advanced packaging to ensure that hbm and gpu integration would be compatible with tsmc's packaging processes”
Technical Impact
NVHBM base die handles memory control functions, increasing bandwidth by up to 30% and reducing power by 15%.
“nvhbm can deliver up to 30 percent more memory bandwidth than standard hbm4e reduce power consumption by up to 15 percent”
Industry Shift
HBM competition now includes base die logic design and advanced processes, not just stacking layers.
“the implication of this division-of-labor adjustment for the industry is that the hbm battleground has expanded”
TSMC's Strategic Gain
TSMC gains foundry foothold in high-end memory logic chips through NVHBM base die orders.
“for tsmc if the nvhbm base die orders from the three major memory makers do concentrate on its 3nm process it would mean gaining a foundry foothold in high-end memory logic chips”
The takeaway
Samsung Electronics began producing NVIDIA's NVHBM base dies using TSMC's 3nm process for the first time, breaking its one-stop memory production model.
