From Dealroom · · 40s
ASML's Hybrid Bonding Tool Challenges Besi's Chip Stacking Dominance
ASML's new hybrid bonding tool threatens Besi's monopoly in advanced chip stacking for AI.
In brief
ASML's new hybrid bonding tool threatens Besi's monopoly in advanced chip stacking for AI. ASML's die-to-wafer hybrid bonding tool could disrupt Besi's control over chip stacking for AI, but production readiness remains uncertain. Originally reported by Dealroom.
ASML Develops Hybrid Bonding Tool
ASML is developing a die-to-wafer hybrid bonding tool, according to SemiAnalysis.
Threat to Besi's Market Position
Besi shares closed down 4.8% on October 16, 2026, after ASML's potential tool.
Production Challenges Remain
ASML has no product timetable, and patent filings do not prove a production-ready tool.
The main idea
ASML's die-to-wafer hybrid bonding tool could disrupt Besi's control over chip stacking for AI, but production readiness remains uncertain.
