Samsung Doubles HBM4 Output Next Year

Samsung to double HBM4 output next year.

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Samsung Doubles HBM4 Output Next Year

Samsung to double HBM4 output next year.

In brief

Samsung to double HBM4 output next year. Samsung will more than double HBM4 chip output next year as it scales production for 12-layer stacks. Originally reported by Seoul Economic Daily.

HBM4 Production Plan

Sixth-generation high-bandwidth memory (HBM4) products are loaded onto a truck for mass-production shipment at Samsung Electronics' Cheonan campus in Chungcheon

Samsung plans to more than double HBM4 output next year.

Glass Carrier Demand

Glass carrier demand will rise 2.5 times next year from current levels.

Glass Carrier Usage

Samsung will clean 50,000 glass carriers monthly next year.

HBM4E Samples

HBM4E Samples

Samsung provided 12-layer HBM4E samples to Nvidia in May.

HBM Production Scale

HBM production is expected to grow nearly 40% next year.

HBM4 Market Share

HBM4 will make up 80% of Samsung's HBM shipments next year.

The short version

Samsung will more than double HBM4 chip output next year as it scales production for 12-layer stacks.

Read the original on Seoul Economic Daily

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