From TechRadar · · 1m 30s
Samsung and Qualcomm's cheaper AI chip breakthrough
A new packaging method using organic materials could slash costs and boost performance for AI processors.
In brief
A new packaging method using organic materials could slash costs and boost performance for AI processors. Organic bridge technology in 2.1D packaging offers a cheaper, more scalable alternative to current silicon-based chip integration methods. Originally reported by TechRadar.
Samsung and Qualcomm team up on AI chips
The two companies are developing organic bridge technology to reduce costs for AI processors. This new approach uses organic materials instead of silicon for connecting chip layers.
What is 2.1D packaging
2.1D is a lower-cost integration method than the current 2.5D standard. It replaces silicon, glass, or ceramic connectors with organic materials like resins and polymers.
The organic bridge explained
The organic bridge is a resin or polymer layer that connects multiple chip dies while providing insulation. It's adapted from printed circuit board manufacturing and can be produced at scale more easily than silicon alternatives.
“It is a mass producer's dream.”
Benefits beyond just cost
The organic bridge improves bandwidth while reducing production costs. It also solves supply chain issues tied to silicon availability, making it attractive for scaling AI data centers.
Other companies are interested too
Intel Foundry Services and TSMC are also developing 2.1D packaging. Multiple Samsung customers have reportedly expressed interest in working with Samsung Electro-Mechanics on the technology.
Development timeline still uncertain
Samsung and Qualcomm filed a patent for the technology around October 2024. Work has been ongoing for about a year, suggesting production-ready chips may still be some time away.
What it means
Organic bridge technology in 2.1D packaging offers a cheaper, more scalable alternative to current silicon-based chip integration methods.
