Amkor Expands Gwangju Chip Facility

Amkor breaks ground on 3 trillion won chip packaging expansion in South Korea's semiconductor hub.

Oct 20, 2026

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Amkor Expands Gwangju Chip Facility

Amkor breaks ground on 3 trillion won chip packaging expansion in South Korea's semiconductor hub.

In brief

Amkor breaks ground on 3 trillion won chip packaging expansion in South Korea's semiconductor hub. Amkor Technology Korea began construction of a chip packaging facility in Gwangju, South Korea, as part of a 3 trillion won investment plan through 2031. Originally reported by TokenPost.

Amkor Breaks Ground

Amkor Technology Korea broke ground on a chip-packaging expansion in Gwangju, South Korea on October 19.

3 Trillion Won Investment

Amkor plans to invest 3 trillion won from 2026 through 2031, hiring about 2,000 people.

Expansion Details

The expansion adds 2 trillion won in investment and 1,000 jobs compared to June's plan for AI and high-performance computing chip packaging.

Regional Semiconductor Plan

South Korea's June plan includes Samsung and SK hynix building two memory chip fabs each in Gwangju with 800 trillion won in investment.

The bottom line

Amkor Technology Korea began construction of a chip packaging facility in Gwangju, South Korea, as part of a 3 trillion won investment plan through 2031.

Read the original on TokenPost

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