# ASML's Hybrid Bonding Tool Challenges Besi's Chip Stacking Dominance

> ASML's new hybrid bonding tool threatens Besi's monopoly in advanced chip stacking for AI.
- Title: ASML's Hybrid Bonding Tool Challenges Besi's Chip Stacking…
- Summary: ASML's new hybrid bonding tool threatens Besi's monopoly in advanced chip stacking for AI. ASML's die-to-wafer hybrid bonding tool could disrupt Besi's…
- Keywords: asml, besi, chip stacking, hybrid bonding, ai chips, lithography, tsmc, intel, semianalysis, startups, business, ASML's
- Source: Dealroom — https://dealroom.co/news/163898-asml-builds-hybrid-bonding-tool-challenging-besis-lock-on-chip-stacking
- Published: 2026-10-19T14:36:28+00:00
- Read time: 1 min
- Topics: asml, besi, chip stacking, hybrid bonding, ai chips, lithography, tsmc, intel, semianalysis, startups, business
## ASML Develops Hybrid Bonding Tool
ASML is developing a die-to-wafer hybrid bonding tool, according to SemiAnalysis.
## Threat to Besi's Market Position
Besi shares closed down 4.8% on October 16, 2026, after ASML's potential tool.
## Production Challenges Remain
ASML has no product timetable, and patent filings do not prove a production-ready tool.
## Key takeaway

ASML's die-to-wafer hybrid bonding tool could disrupt Besi's control over chip stacking for AI, but production readiness remains uncertain.