# NVIDIA's Unified Spec Forces Samsung to Use TSMC 3nm

> Samsung adopts TSMC's 3nm for NVIDIA's HBM base die, ending its one-stop memory production model.
- Title: NVIDIA's Unified Spec Forces Samsung to Use TSMC 3nm
- Summary: Samsung adopts TSMC's 3nm for NVIDIA's HBM base die, ending its one-stop memory production model. Samsung Electronics began producing NVIDIA's NVHBM base…
- Keywords: nvhbm, tsmc 3nm, samsung electronics, hbm4e, base die, 1c dram, nvidia, sk hynix, micron, amd, finance, markets
- Source: BigGo Finance — https://finance.biggo.com/news/9857618a-22eb-4a63-acbe-e6226039ca98
- Author: BigGo Finance
- Published: 2026-10-19T00:35:18+00:00
- Read time: 1 min
- Topics: nvhbm, tsmc 3nm, samsung electronics, hbm4e, base die, 1c dram, nvidia, sk hynix, micron, amd, finance, markets
## NVIDIA's Unified Spec
NVIDIA requires Samsung, SK Hynix and Micron to use TSMC's 3nm process for NVHBM base dies.

> nvidia has made a uniform demand of its three nvhbm suppliers, samsung sk hynix and micron: the base die must use tsmc's 3nm process
## Samsung's Compliance
Samsung Electronics decided to comply after internal review, marking first use of TSMC's 3nm for HBM chip manufacturing.

> after internal review south korea's samsung electronics decided to comply marking the first time it has brought tsmc's process into the hbm chip manufacturing stage
## Base Die Shift
Samsung's standard HBM4 and HBM4E remain in-house while NVHBM base dies use TSMC 3nm.

> samsung's standard hbm4 and hbm4e will remain integrated in-house manufacturing with the base die using samsung's 4nm process
## Samsung's Backup Plan
Samsung validates producing NVHBM base dies on its own foundry lines as backup for TSMC capacity shortages.

> samsung is simultaneously validating whether it can manufacture nvhbm base dies on its own foundry lines as a backup for when tsmc capacity is insufficient
## Historical Context
Samsung and TSMC previously cooperated on packaging compatibility but not chip manufacturing.

> four years ago the two cooperated in advanced packaging to ensure that hbm and gpu integration would be compatible with tsmc's packaging processes
## Technical Impact
NVHBM base die handles memory control functions, increasing bandwidth by up to 30% and reducing power by 15%.

> nvhbm can deliver up to 30 percent more memory bandwidth than standard hbm4e reduce power consumption by up to 15 percent
## Industry Shift
HBM competition now includes base die logic design and advanced processes, not just stacking layers.

> the implication of this division-of-labor adjustment for the industry is that the hbm battleground has expanded
## TSMC's Strategic Gain
TSMC gains foundry foothold in high-end memory logic chips through NVHBM base die orders.

> for tsmc if the nvhbm base die orders from the three major memory makers do concentrate on its 3nm process it would mean gaining a foundry foothold in high-end memory logic chips
## Key takeaway

Samsung Electronics began producing NVIDIA's NVHBM base dies using TSMC's 3nm process for the first time, breaking its one-stop memory production model.