# Singapore startup bets on 2D semiconductors for chip fabs

> Nexstrom is raising funds to manufacture ultra-thin transistors at scale, targeting production between 2030 and 2035.
- Title: Singapore startup bets on 2D semiconductors for chip fabs
- Summary: Nexstrom is raising funds to manufacture ultra-thin transistors at scale, targeting production between 2030 and 2035. Nexstrom is developing equipment to…
- Keywords: nexstrom, singapore, semiconductors, 2d materials, transition-metal dichalcogenides, chip manufacturing, seed funding, tsmc, intel, samsung, wafer production, lance li
- Source: TechCrunch — https://techcrunch.com/2026/09/22/singapores-nexstrom-wants-to-bring-2d-semiconductors-to-chip-fabs
- Author: Kate Park
- Published: 2026-09-22T13:20:00+00:00
- Read time: 1 min
- Topics: nexstrom, singapore, semiconductors, 2d materials, transition-metal dichalcogenides, chip manufacturing, seed funding, tsmc, intel, samsung, wafer production, lance li
## Silicon transistors hit a wall
Shrinking transistors to pack more onto chips causes electron leakage, power loss, and heat problems. Chipmakers need a new approach.
## Meet 2D semiconductors
Transition-metal dichalcogenides, or TMDs, are materials just a few atomic layers thick that could replace silicon and shrink chips further.
## The lab-to-factory gap
Scientists can make high-quality 2D materials in labs, but only in tiny quantities. Nexstrom aims to produce them at scale on standard 300mm wafers.

> In the lab, people can get very small, high-quality materials, but only on a very small scale.
## Industry giants are watching
TSMC, Intel, Samsung, and IMEC are all developing 2D material integration. Nexstrom plans to partner with them rather than compete directly.
## Nexstrom raises 12 million
The Singapore startup closed a seed round from Xora, Foothill Ventures, and SEEDS, bringing total funding to 15 million dollars.
## Scaling from inches to feet
Nexstrom has proven results on 2-inch to 6-inch wafers and plans to complete 8-inch wafers by end of October using its newly installed 12-inch system.
## Consistent growth is the challenge
The biggest hurdle is reliably growing TMDs across an entire full-size wafer. Nexstrom is working on material quality, process control, and measurement capabilities.
## Commercial production in 2030s
Nexstrom expects its equipment to be ready for commercial production between 2030 and 2035, with funding going toward team expansion and customer qualification programs.
## Key takeaway

Nexstrom is developing equipment to grow 2D materials directly on standard chip wafers, addressing the gap between lab-scale success and mass manufacturing.