# Steam Frame teardown finds cooling fan hard to fix

> iFixit praises the VR headset's repairability overall, but warns that accessing the cooling fan requires extensive disassembly through dense internal hardware.
- Title: Steam Frame teardown finds cooling fan hard to fix · Engadget
- Summary: iFixit praises the VR headset's repairability overall, but warns that accessing the cooling fan requires extensive disassembly through dense internal…
- Keywords: steam frame, valve, ifixit, vr headset, repairability, teardown, cooling fan, technology, Steam, Frame, finds, cooling
- Source: Engadget — https://engadget.com/2281207/steam-frame-teardown-reveals-one-problem-repairs
- Author: Will Shanklin
- Published: 2026-10-11T18:30:00+00:00
- Read time: 1 min
- Topics: steam frame, valve, ifixit, vr headset, repairability, teardown, cooling fan, technology
## iFixit tears down Steam Frame
iFixit's teardown of Valve's Steam Frame VR headset found it generally repairable, but flagged one significant problem: the cooling fan is buried deep inside.
## Fan requires extensive disassembly
To reach the cooling fan, technicians must snake past optical assemblies through dense thermal hardware, cables and other components. Fans accumulate dust and wear out over time.
## Most repairs are straightforward
The head strap detaches via quick-release latches. Sweat-absorbing parts including nose bridge and cushions are replaceable. Lenses attach magnetically, making display repairs relatively straightforward.
## Some parts unavailable at launch
Replacement parts will be available from iFixit's store, but batteries and displays won't be available when the Steam Frame parts store goes live. iFixit hopes to change this.
## High price limits appeal
Starting at one thousand fifty nine dollars, the Steam Frame costs considerably more than the Meta Quest three and arrived late to market, making it a tough sell despite solid repairability.
## Key takeaway

iFixit's teardown of Valve's Steam Frame found it generally repairable, but the cooling fan is buried deep inside and difficult to reach, requiring disassembly through optical assemblies and thermal hardware.