# Tencent Raises $5 Billion for AI Chips

> Tencent seeks $5 billion in bonds to lease 100,000 AI chips from Oracle.
- Title: Tencent Raises $5 Billion for AI Chips · Startup Fortune
- Summary: Tencent seeks $5 billion in bonds to lease 100,000 AI chips from Oracle. Tencent raised $5 billion in bonds to fund AI infrastructure, including leasing…
- Keywords: tencent, oracle, ai chips, bonds, hunyuan, ai buildout, cloud computing, startups, business, Raises, Billion, Chips
- Source: Startup Fortune — https://startupfortune.com/tencent-moves-to-raise-5-billion-in-bonds-to-fund-its-ai-buildout
- Published: 2026-10-13T00:40:27+00:00
- Read time: 1 min
- Topics: tencent, oracle, ai chips, bonds, hunyuan, ai buildout, cloud computing, startups, business
## Tencent seeks $5 billion bond sale
Tencent plans an offshore bond sale of up to $5 billion, split across US dollar and offshore yuan tranches.
## Second debt raise in 2026
This would be Tencent's second major debt raise of 2026, following a $4.66 billion dual-currency offering in June.
## AI chip leasing deal with Oracle
Tencent signed a five-year, $7 billion lease for about 100,000 advanced AI chips through Oracle's Asia data centers.
## Why lease chips?
Tencent cannot legally buy and import these AI chips into China under US export controls.
## Capital expenditure surge
Tencent's capital expenditure hit RMB 52.8 billion, about $7.8 billion, up 176% year over year.
## Free cash flow negative
Free cash flow went negative, down RMB 13.8 billion, as AI spending accelerates.
## Bond funds AI buildout
The new bond will mainly support AI-related capital expenditure, putting fundraising directly behind compute buildout.
## Key takeaway

Tencent raised $5 billion in bonds to fund AI infrastructure, including leasing 100,000 AI chips from Oracle.